★ ★
HOME    E-TOPIA    About this site    mypage        Japanese    library    university    Feedback

東京学芸大学リポジトリ >
Comprehensive Educational Science >
Bulletin of Tokyo Gakugei University. Section VI, Technology, home economics and field tudies(ISSN:03878953/13411705) >

 

Files in This Item:

There are no files associated with this item.

Title :BGAはんだ接合部に生ずるひずみ速度の有限要素法解析
Title alternative :FEM analysis of strain rate that is occurred at BGA solder joint
Authors :林, 丈晴
海老原, 理徳
Authors alternative :HAYASHI, Takeharu
EBIHARA, Yoshinori
Issue Date :28-Nov-2003
URL :http://webcatplus-equal.nii.ac.jp/libportal/DocDetail?txt_docid=NCID%3AAN10475963
Type Local :紀要論文
ISSN :13411705
Publisher :東京学芸大学紀要出版委員会
URI :http://hdl.handle.net/2309/2968
Citation :東京学芸大学紀要. 第6部門, 技術・家政・環境教育 Vol.55 p.1 -11
Appears in Collections:Bulletin of Tokyo Gakugei University. Section VI, Technology, home economics and field tudies(ISSN:03878953/13411705)
Bulletin of Tokyo Gakugei University. Section VI, Technology, home economics and field tudies(ISSN:03878953/13411705)

Please use this identifier to cite or link to this item: http://hdl.handle.net/2309/2968